SSP’s industrial automation EMI O-rings white paper is now available. Find out what’s inside and how to get this free resource.
Robots, co-bots and other industrial automation technologies need to withstand environments where’s there’s dust, moisture, machine oils, and electronic noise. EMI O-rings made from conductive silicones seal out the physical environment and help protect circuits against electromagnetic interference (EMI), a growing problem on factory floors.
Get the White Paper
In a new white paper, Specialty Silicone Products (SSP) explains what you need to know about EMI O-rings for industrial automation. From materials of construction to manufacturing processes, and from market predictions to real-world applications, you’ll learn how these donut-shaped gaskets are taking a bite out industrial automation challenges.
Molded and Bonded O-Rings
For industrial automation companies that need EMI O-rings, Specialty Silicone Products provides both molded and bonded solutions.
Molded EMI O-rings are produced as one-piece gaskets that don’t require bonding and, therefore, reduce the risk of EMI leakage. SSP can ship you ready-to-mold compounds like our SSP-502 nickel-graphite silicones, or we can produce your molds at our in-house machine shop and then use them to mold your EMI O-rings at our ISO 9001:2015 certified manufacturing facility.
Bonded EMI O-rings use tooling that’s faster and less expensive to produce. If you need to revise a product design, bonding may be a better choice since you can get more prototypes than if you’d waited for a single mold. To prevent EMI leakage, SSP uses a hot splicing method that applies heat and pressure to a conductive silicone with a durometer similar to the EMI cord itself. This eliminates the “hard spot” found in other gaskets.
Plus, because we use a silicone adhesive instead of acrylic, the joint has better temperature resistance for more reliable performance under extreme conditions. If you need EMI O-rings for industrial automation, contact Specialty Silicone Products.
